Ideally suited for applications with reduced test pads access
| Dynamic control |
The trend towards miniaturization and increased performance of electronic components and
assemblies is still unbroken. In order to save space, but also to avoid disturbances on high speed
buses, test pads on the application are reduced as much as possible.
As a result, classic in-circuit test approaches are in some cases already unable to achieve sufficient test coverage
because access to test points is lacking. This is where ProMik's latest SMART ICT technology comes into play.
Here we use our microcontroller know-how to execute test functions directly on the application. Thus required test points
are limited to the central microcontroller/SoC. In the future, you will benefit from high-speed transfer rates not only during
programming, but also during testing. Even with boundary scan test scopes, SMART ICT helps you save cycle times.
Enormous saving potentials result, among other things, with regard to test coverage, equipment and development.
SMART ICT sets new standards in electronics production and can certainly be described as a revolution
in the testing of electronic assemblies.
We are continuously developing our solutions. We recognize potentials at an early stage thanks to our customer proximity.
Resulting in a growing portfolio of innovative technologies and solutions. Through modular SMART ICT software updates
ProMik`s Multi Standard Programmer is extended by numerous On-Board test functions.
In line with current requirements, we offer you a broad portfolio of innovative SMART ICT modules.
These enable complex voltage sequences, precise current measurements in the µA range and fieldbus testing.