bye, test pads

Boundary Scan Alternative:
SMART ICT – the innovation
for less test pads,
equipment & costs

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Testing without test pads - the trend towards miniaturization

While the complexitiy of modern control units is increasing, they have to be as small as possible simultaneously. For this space savement, among other things, test pads are removed via which applications are checked so far. This leads to the suppression of conventional methods. They are replaced by modern practices which require less test pads like ProMik's SMART ICT – the Boundary Scan alternative per excellence.

SMART ICT advantages at a glance

  • Maximum test coverage
  • Cost savings through parallelity
  • FCTs with only one hardware
  • Higher production throughput
  • Balanced cycle times

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Boundary Scan – Testing via Debugging Interfaces

Boundary Scan (also known as IEEE Std 1149.1) is a method for testing digital and analog components as long as they obtain the Boundary Scan logic. The MCU is contacted via the debugging interface (JTAG). Commands for the circuit are then sent. Through the connection to the debugging interface, less test pads are required. One disadvantage of the test function is, however, that it is limited to devices with integrated Boundary Scan logic, which only includes a limited number of components. The testing of memories via Boundary Scan is not possible, for example.

SMART ICT – the outstanding Boundary Scan Alternative

Based on ProMik's proven bootloader technology, SMART ICT enables new possibilities to maximize the productivity within manufacturing. The idea behind the test innovation is to use the functions of the circuit and to enable the execution of tests via MCU functionalities. Like this, the Boundary Scan alternative realizes test functions directly via the microcontroller. This is done simultaneously with the initial flash programming. Through this parallelity cycle times are met again, additional equipment is saved and costs are therefore minimized.

SMART ICT - Use Case

 

 

One example for the use of SMART ICT is the testing of the interface communication on the application.

Like this, the CAN-FD communication of the device can be checked, among other things, quickly and realiably: after the SMART ICT test software is downloaded  in the microcontroller via JTAG, it is executed on the application. This causes CAN-FD frames to be sent via the microcontroller to the dedicated communication lines.

The programmer can now receive the frames and thus verify the functionality of the periphery.

 

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One example for the use of SMART ICT is the testing of the interface communication of the application.

Among other things, the CAN-FD communication of the device can be checked quickly and realiably: after the SMART ICT test software is downloaded  in the microcontroller via JTAG, it is executed on the application. This causes CAN-FD frames to be sent via the microcontroller to the dedicated communication lines.

The programmer can now receive the frames and thus verify the functionality of the periphery.

 

Get a quote

hello, technology

SMART ICT for parallel
testing without or with
only few test pads

 

 

  • ProMik Bootloader technology for the execution of test functions
  • Parallel resources for testing on panel level
  • Field Bus communication BroadR-Reach, CAN-FD, CAN, Single Wire CAN, FlexRay, LIN
  • Application power-up control and current measurement (ranging from 1uA to 1A)
  • Voltage measurement 

 

SMART ICT - functionality

With the help of the flash programmer, the microcontroller of the device under test (DUT) is contacted via 
the debugging interface. Other than with Boundary Scan, the device does not have to obtain a Test Access Port
or the Boundary Scan logic in order to be fully tested.

During the inital flash programming, the SMART ICT test software is downloaded in the microcontroller of the DUT.
Through the intelligence of the circuit, different test functions can be executed with the MCU. In contrast to the
In Circuit Test (ICT) exact testing of measured variables can't be made with test methods like SMART ICT or
Boundary Scan. Here the focus lies on the checking of the functionality and the finding of errors in the circuit. 

Through the enabled parallelity of the Boundary Scan alternative cycle times can be met again and costs saved
significantlly.

Additionally, the combination of Boundary Scan and SMART ICT functions enables higher test coverage in production.

datasheet

SMART ICT products: 

These customers trust us

Customer reference list

Balluff GmbH  /  BCS Automotive Interface Solutions  /  Bosch  /  Brose Fahrzeugteile GmbH & Co. KG  /  Continental  /  
Freetech Intelligent Systems  /  Helbako  /  Hyundai MOBIS  /  Jabil Circuit, Inc.  /  Kimball Electronics  /  Kostal Automobil
Elektrik  / Küster Automotive  /  Kyungshin Corporation  /  Lear  /  LG Innotek  /  Magneti Marelli  /  Mando Hella  /  
Marquardt  /  Mekra Lang  / Melecs EWS  /  PIA Automation  /  Preh  /  Preh Joyson Automotive  /  S&T Motiv Electronics  /  
SL Corporation  /  TRW Automotive  / Valeo  /  Veoneer  /  Visteon  /  Yura Corporation  /  ZF Group  /  Zollner Elektronik AG